SPIE 2015 Launch: 3rd Generation MicroCAM Thermal Imaging Core

MicroCAM 3 Ultra low power coreThermoteknix is launching MicroCAM 3 at SPIE DSS 2015. This new module has higher performance, a faster frame rate, lower power, in a smaller package.

Weighing just 30g, MicroCAM 3 draws <0.55W of power and is available in both 384×288 17µ and 640×480 17µ formats. MicroCAM 3 features Thermoteknix patented shutterless XTi Technology® so viewing is never interrupted.  This also does away with moving parts making MicroCAM 3 ultra-reliable, silent and super power-efficient.

In a cylindrical package, the module is ready to integrate into third party OEM technology – from aerospace/defence, police and security/border patrol, search & rescue to hunting, wildlife monitoring, scientific and R&D devices.The option of a fully waterproofed, sealed housed MicroCAM 3 with a variety of pre-integrated lenses is also available for users looking for a complete solution.

The option of a fully waterproofed, sealed housed MicroCAM 3 with a variety of pre-integrated lenses is also available for users looking for a complete solution.